Leo, C.P., Yu, Kok Hwa, Jaafar, Mariatti, Dao Ho,, Ngo Anh and Saeed, Nagham ORCID: https://orcid.org/0000-0002-5124-7973 (2025) Advancing ESG reporting through life cycle assessment in semiconductor manufacturing: tools, frameworks, and opportunities. In: The 13 International Conference on Robotics, Vision, Signal Processing and Power Applications (RoViSP 2025), 2-3 Sept 2025, Penang, Malaysia. (Submitted)

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Abstract

The semiconductor industry plays a pivotal role in enabling modern technologies, yet its manufacturing processes are among the most resource- and energy-intensive in the electronics sector. As environmental, social, and governance (ESG) reporting becomes a strategic imperative, Life Cycle Assessment (LCA) has emerged as an important methodology for quantifying and communicating the environmental impacts of semiconductor products across their entire lifecycle. This review paper presents a comprehensive analysis of recent advancements in LCA methodologies and their integration into ESG strategies for semiconductor manufacturers. It examines literature ranging from early eco-nomic input-output models to advanced, AI-driven digital twin frameworks, as adopted by leading firms. The review also highlights key contributions from re-cent studies on carbon footprint modeling, gate-to-gate boundary approaches, and the role of nanomaterials in sustainable electronics. Despite progress, challenges remain, including inconsistent data availability, the complexity of multi-tier sup-ply chains, and the lack of harmonized industry-wide LCA standards. Addition-ally, accurately assessing Scope 3 emissions and addressing upstream impacts pose persistent difficulties. Regulatory shifts, such as the EU Green Claims Directive and increased investor scrutiny, further drive the need for transparent and credible LCA based ESG reporting. This paper concludes by identifying existing methodological gaps and proposing future research directions, including the development of semiconductor specific product category rules (PCRs), standardized data platforms, and deeper supplier engagement.

Item Type:	Conference or Workshop Item (Paper)
Keywords:	Life cycle assessment, ESG, Semiconductor
Subjects:	Computing
Related URLs:	https://rovisp.eng.usm.my/
Depositing User:	Nagham Saeed
Date Deposited:	09 Sep 2025 08:24
Last Modified:	10 Sep 2025 10:30
URI:	https://repository.uwl.ac.uk/id/eprint/14051

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